• Welcome to the US Navy's
    Electronics Manufacturing Center of Excellence
  • ADVANCED
    PACKAGING
    TECHNOLOGIES
    GPS SYSTEMS WITH LOWER COSTS
  • HIGH POWER
    HIGH DENSITY
    INTERCONNECTIONS
    SAVES $1.8M PER DDG1000
  • FLIP-CHIP
    TECHNOLOGIES
    SAVES $410K PER SHIP SET
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Current Projects

S2558 — Manufacturing Cost Reduction for LCS Scalable Electronic Warfare (EW) System Phase 1

There is an urgent need for enhanced Electronic Warfare (EW) capability for Littoral Combat Ship (LCS). Under the concept of commonality, leveraging the Surface Electronics Warfare...

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S2485 — Solid State Switch Assembly for the AN/SPY -1D and D (V) Transmitter

The Solid State Switch Assembly (SSSA) Navy ManTech project objective is to develop an upgrade for the AN/SPY-1 transmitter. This will to enable the Navy to forward-fit and retrofit 72 DDG 51 class...

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S2385 — Continuous Wave Illuminator Transmitter Upgrade

The Radar Transmitter used in the AEGIS MARK 99 Fire Control System (FCS), operates in conjunction with other components within the FCS to provide radiated energy for semi-active homing...

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The Empfasis is on affordability through MBE Benchmarking and RF MMIC Packaging

Model based enterprise (MBE) is defined in MIL-STD-31000 as an integrated and collaborative environment, founded on a 3D product definition (model based definition or MBD) shared across the enterprise, enabling the rapid, seamless, and affordable deployment of products, from concept to disposal.

Recently, more and more MMICs are provided as packaged surface mount device (SMD) components. These packaged MMICs can be handled like any other SMD components which makes them easier to use, cost effective and allows installation on printed circuit boards (PCBs) using automation.

Titles include:

  • Model Based Enterprise Benchmarking
  • Message from the Director
  • Guidelines for RF MMIC Packaging
  • Services and Training Overview